Mold Material - Company Ranking(16 companies in total)
Last Updated： Aggregation Period:Sep 24, 2025〜Oct 21, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Base material aluminum foil: thickness 20 to 50 μm. Release film can be selected as single-sided coat or double-sided coat, available in cle... | As a release material for printed circuit boards. | ||
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東洋アルミニウム
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- Featured Products
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Release material "Sepanium" for printed circuit board manufacturing process.
- overview
- Base material aluminum foil: thickness 20 to 50 μm. Release film can be selected as single-sided coat or double-sided coat, available in cle...
- Application/Performance example
- As a release material for printed circuit boards.
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東洋アルミニウム
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